Company Introduction

Equipment:
Automatic CMP Polishing Machine, Automatic Wax Bonding Machine, Automatic Horizontal Precision Grinding Machine, Automatic Vertical Precision Grinding Machine, Automatic Precision Polishing Machine, Four Axis Precision Polishing Machine, Automatic Polishing Machine, Automatic LED Wafer Laminator, Double-Side Lapping Polishing Machine, Automatic Wax Bonding Machine, Automatic Precision Polishing Machine, Automatic CMP Polishing Machine

Consumables:
Fixed Diamond Lapping Plate, Liquid Wax, Solid Wax, Diamond Grinding Wheel (Dressing Free), Dressing Stone, Ceramic Plate, Ceramic Condition Ring, Copper Plate, Fine Polishing Plate, Polishing Pad, CMP Slurry, Diamond Slurry, Diamond Dresser, Diamond Scriber, Cleaner, Coolant, Wax Removal Detergent, Polycrystalline Diamond Powder, Boron Carbide Powder, Silicon Carbide Powder, Corning Tool, Nickel-Plated Diamond Powder